SMT Screen Printer GKG G9+ | Solder Paste Stencil Printer
The GKG G9+ fully automatic solder paste printer features three key intelligent functions: template detection, which uses a CCD with light source compensation to detect net plate blockages and trigger automatic cleaning; an automatic dispensing system, which can achieve precise glue dispensing, solder paste application, line drawing, and filling using
SMT manufacturer – High-precision GKG fully automatic solder paste printer
- GKG G9+ automatic solder paste printer template detection function:
By using light source compensation above the template and real-time detection of the mesh condition of the template with CCD, it is possible to quickly detect and determine whether the template is clogged after cleaning and perform automatic cleaning. This is a two-dimensional detection method for printed circuit boards. - GKG G9+ automatic solder paste printer automatic dispensing system:
According to different printing process requirements, after the printing is completed, precise dispensing, solder paste dispensing, line drawing, filling and other operations can be performed on the printed board; at the same time, the dispensing head is equipped with a heating function, which can be used in low environmental temperatures. At this time, the fluidity of the glue will be improved. - GKG G9+ automatic solder paste printer bottle-type automatic solder filling and solder paste detection function:
It can automatically add solder paste at fixed intervals to ensure the quality of the solder paste and the amount of solder paste in the template. To ensure the printing quality of customers and improve production efficiency. Through sensors, the amount of solder paste on the template can be controlled, and the quality can be stabilized.
| Parameter | Specification | |
|---|---|---|
| Machine Performance | Repeat Position Accuracy | ±10μm@6σ, CPK≥2.0 |
| Print Accuracy | ±18μm@6σ, CPK≥2.0 | |
| NCP-CT | 7s | |
| HCP-CT | 18s/pcs | |
| Process CT | 4min | |
| Change Line CT | 2min | |
| Substrate Processing | Max Board Size | 450×340mm |
| Min Board Size | 50×50mm | |
| Board Thickness | 0.4~6mm | |
| Camera Mechanical Range | 450×340mm | |
| Max Board Weight | 3kg | |
| Board Edge Clearance | 2.5mm | |
| Board Height | 15mm | |
| Transport Speed | 900±40mm | |
| (Max) Transport Speed | 1500mm/s max | |
| Transport Direction | One stage |
