Dip Line Solutions
Complete DIP Line Layout Planning
Full‑Line Pre‑Shipment Commissioning
Professional Operation & Technical Training
Reliable After‑Sales & Global On‑site Support
DIP(THT) Complete Production Process
The DIP through‑hole assembly workflow runs after SMT reflow soldering. It is designed for large‑size, high‑current through‑hole components which cannot be processed by surface‑mount technology. A well‑organized DIP line significantly improves soldering stability and reduces PCB rework rate.
1. PCB Preparation & Component Sorting
Prepare bare PCBs and classify radial, axial, plug‑in components. Operators pre‑process component leads to avoid bending damage during manual insertion.
2. Manual Insertion Station
On anti‑static insertion conveyor line, workers place through‑hole components into corresponding PCB holes. Semi‑automatic insertion machines are optional for high‑volume production.
3. Flux Spraying & Pre‑heating
Uniform flux spraying removes surface oxide. Multi‑zone pre‑heating slowly raises PCB temperature, effectively preventing thermal deformation and board delamination before wave soldering.
4. Dual‑Wave Soldering & Cooling
Turbulent wave penetrates narrow PCB holes, then smooth wave levels solder joints. Afterwards forced air cooling stabilizes solder joints for subsequent inspection operations.
5. Lead Trimming & Cleaning
Excess residual component pins are trimmed. Optional ultrasonic or spray cleaning removes solder flux residue on finished circuit boards.
6. Visual Inspection, Rework & Functional Test
Inspect cold solder, solder bridging and missing pins manually or by DIP‑AOI. Repair defective PCBs, then run ICT / FCT functional testing before final packing.
Core Equipment For DIP Turn‑key Production Line
According to customer’s production capacity, workshop dimension and budget, we configure suitable DIP production equipment. Both standard semi‑automatic configuration and high‑end fully‑automated solutions are available.
Standard Basic Configuration
- Anti‑static manual insertion conveyor line (customizable length)
- PCB loader & unloader for wave soldering machine
- Lead‑free dual‑wave soldering system
- Cooling conveyor after wave soldering
- PCB support fixtures and anti‑static working accessories
Optional Upgraded Configuration
- Automatic axial & radial component insertion machine
- Selective soldering unit for high‑precision products
- Automatic lead trimming machine
- DIP‑AOI visual inspection machine for solder joint checking
- PCB online cleaning machine and dedicated rework repair station
Key Benefits of Our DIP Whole‑Line Solution
Our customized DIP production lines help manufacturers balance production capacity, product quality and overall operating expenditure for THT assembly.
Flexible Production Capacity
Easily switch between low‑volume prototype runs and high‑volume mass manufacturing. Modular station layout allows you to adjust line length according to your actual order mix.
Consistent Soldering Quality
Precise wave soldering temperature and conveyor speed control reduce cold solder joints, bridging and solder ball defects, delivering stable soldering results for through‑hole components.
Lower Labor Dependency
Automated pin cutting, flux spraying and soldering modules reduce repetitive manual work. It helps to ease recruitment pressure on experienced DIP assembly operators.
Easy Future Expansion & Upgrade
Modular design supports later retrofitting of selective soldering, automatic AOI inspection or cleaning units. Your initial investment can grow alongside your product roadmap.
Frequently Asked Questions
Answers to common questions about DIP whole‑line solutions and turn‑key projects
Q1: What factors should be considered when planning a new DIP production line?
Available factory floor space, power capacity, exhaust & ventilation condition, target daily PCB output, product mix (through‑hole board thickness and component types), as well as future expansion potential.
Q2: Can you design a semi‑automatic DIP line instead of full‑automatic?
Yes. Semi‑automatic DIP configurations are widely adopted for small‑to‑medium batch production. Manual insertion stations are reserved, matched with automatic flux spraying, wave soldering and cooling conveyor modules to balance investment and throughput.
Q3: How long is the typical lead‑time for a complete DIP turn‑key line project?
After layout drawing confirmation, standard whole‑line equipment delivery takes 4‑7 weeks. On‑site installation, commissioning and operator training generally require 5‑10 working days, subject to site preparation status at your facility.
Q4: Does the DIP line support mixed production with SMT assemblies?
Absolutely. We can design docking conveyor interfaces so that PCBs coming out from SMT production can directly feed into the DIP section, which is ideal for mixed SMT‑through‑hole circuit‑board manufacturing for power boards and control boards.
Q5: What after‑sales support is provided for the DIP whole‑line solution?
We supply spare‑part reference list, remote technical support, periodic consultation for preventive maintenance. On‑site service is available upon request for troubleshooting and production‑optimization adjustments.