gkg-gls-automatic-smt-stencil-printer

GKG-GLS Automatic SMT Stencil Printer

GKG-GLS Automatic SMT Stencil Printer

The GKG GLS is a fully automatic solder paste printer designed for high-precision SMT production, featuring advanced vision systems, flexible PCB handling up to 510×510mm, and intelligent cleaning capabilities for optimal printing quality and efficiency.

The GKG GLS is a fully automatic solder paste printer developed for PCB assemblies that exceed the working area of standard compact SMT printers. With a supported PCB size of up to 510 × 510 mm, it provides a practical printing platform for large panels, LED boards, industrial electronics and other assemblies that require a wider printing area.

The machine combines vision alignment, programmable squeegee movement, controlled stencil separation, PCB support and automatic underside cleaning. These functions allow the printing process to be stored and repeated instead of depending on manual alignment and operator adjustment.

gkg-gls-automatic-smt-stencil-printer
CategoryParameterSpecification
Machine PerformanceRepeat Position Accuracy±12.5μm@6σ CPK≥2.0
Print Accuracy±22μm@6σ CPK≥2.0
NCP-CT (w/o cleaning & printing)<7.5 sec
HCP-CT (w/ cleaning & printing)19s/pcs
Process CT5min
Transfer Line CT3min
Substrate ProcessingMaximum Board Size510×510mm
Minimum Board Size50×50mm
Board Thickness0.4~6mm
Camera Mechanical Range510×510mm
Maximum Board Weight5kg
Board Edge Clearance2.5mm
Board Height23mm (beyond special support pin)
Transport Speed900±40mm
Max Transport SpeedSectional control, 1500mm/s
Transport ModeOne stage
Transport DirectionLeft to right / Right to left / In and out same
Support & ClampingSupport SystemMagnetic Pin (65mm) / Support Block (65mm) / Manual Up-down table
Board ClampManual retractable upper tablet / Side clamping / Vacuum adsorption function
Printing ParametersPrint Speed10~200mm/sec
Print Pressure0.5~20Kg
Print ModeOne/Twice
Squeegee TypeRubber/Squeegee Blade (angle 45°/55°/60°)
Snap-off0~20mm
Snap-Speed0~20mm/sec
Template Frame Size470×370mm~737×737mm
Stencil PositioningAutomatic Y-direction positioning (with manual compensation adjustment)
Cleaning ParametersCleaning SystemDry, Wet, Vacuum three modes
High Speed CleaningWeave cleaning
Cleaning System TypeSide spray type
Cleaning StrokeAutomatic generation based on board size
Cleaning PositionPost cleaning
Cleaning Speed10-200mm/sec
Cleaning Fluid ConsumptionAuto & Manually adjustable
Cleaning Paper ConsumptionAuto & Manually adjustable
Vision ParametersCCD FOV10×8mm
Camera Type130 Thousand CCD Digital camera
Camera SystemLock up/down optics structure
Camera Cycle Time300 ms
Fiducial Mark TypesRound, Square, Diamond, Cross, Pad and profile
Mark Size0.5-6mm
Mark NumberMax: 4pcs
Stay Away NumberMax: 1pc
Hardware ParametersPower SourceAC:220±10%, 50/60Hz, 2.2KW
Air Pressure4~6Kgf/cm²
Air ConsumptionApprox. 5L/min
Operating Temperature-20℃~+45℃
Working Environment Humidity30%~60%
Machine Height (w/o Tower light)1500mm
Machine Length1258mm
Machine Width1425mm
Machine WeightApprox. 1100Kg
Equipment Load Bearing650Kg/m²

1. Large-Format PCB Handling Capability The GLS supports PCBs up to 510×510mm, making it ideal for large-format applications such as LED panels, automotive electronics, and industrial control boards. This generous size capacity allows manufacturers to handle bigger boards without compromising on precision or speed.

2. High Precision and Stability With ±12.5μm repeat positioning accuracy and ±22μm print accuracy (both at CPK≥2.0), the GLS delivers consistent, high-quality solder paste printing. The 6-sigma statistical process control ensures reliable production quality, reducing defects and rework costs.

3. Flexible and Versatile Operation The machine accommodates a wide range of PCB sizes from 50×50mm to 510×510mm and thicknesses from 0.4mm to 6mm. Multiple transport directions (left-to-right, right-to-left, in-and-out same) provide seamless integration into various production line layouts.

4. Advanced Triple-Mode Cleaning System The GLS features a comprehensive cleaning system with dry, wet, and vacuum modes, combined with side spray technology and weave cleaning. This ensures thorough stencil aperture cleaning, maintaining print quality and extending stencil life. Auto-adjustable consumable usage optimizes operating costs.

5. Intelligent Vision Alignment Equipped with a 130,000-pixel CCD digital camera and lock up/down optics structure, the GLS provides rapid and accurate fiducial mark recognition. Support for 4 marks + 1 stay-away point enables complex board alignment, while the 300ms camera cycle time minimizes overall cycle time.

6. Robust and Reliable Design Weighing approximately 1100Kg, the GLS features a solid, vibration-resistant construction that ensures stable operation during high-speed printing. The machine operates reliably across a wide temperature range of -20°C to +45°C, making it suitable for diverse factory environments.

7. User-Friendly and Cost-Effective The GLS offers auto and manually adjustable settings for cleaning fluid and paper consumption, giving operators flexibility while controlling costs. The manual retractable upper tablet and automatic Y-direction stencil positioning simplify setup and changeover processes.

8. Wide Process Window With print pressure ranging from 0.5 to 20Kg and print speed from 10 to 200mm/sec, the GLS adapts to various solder paste types and printing requirements. Multiple squeegee blade angles (45°/55°/60°) further enhance process flexibility.

PCB Loading and Support

The PCB enters the printing area through the conveyor and stops at the programmed position. Supports and clamps hold the board at a stable height during printing.

For a large PCB, the support arrangement is especially important. Unsupported areas can move under squeegee pressure and change the amount of paste transferred through the stencil.

Fiducial Recognition and Alignment

The camera recognizes the selected PCB and stencil reference marks. The machine calculates the required positional correction before bringing the PCB and stencil into printing position.

Solder Paste Printing

The squeegee moves across the stencil using the stored speed, pressure and stroke settings. Solder paste passes through the apertures and is deposited on the corresponding PCB pads.

Controlled Release

The stencil separates from the PCB according to the programmed profile. The correct release setting helps preserve deposit shape and reduce paste remaining in the apertures.

Cleaning and Transfer

The stencil underside is cleaned according to the selected mode and interval. The printed PCB then moves to SPI inspection or component placement.

Placement board image

The main reason to select the GLS is board size. Its maximum working area of approximately 510 × 510 mm is larger than the standard 400 × 340 mm area commonly listed for GSE and GSK machines.

The GSE is suited to general SMT printing within a compact board range. The GSK targets precision printing and additional production-data functions on selected configurations. The GLS is the stronger candidate when a large PCB or panel cannot fit the smaller platforms.

Do not choose solely by model level. Compare:

  • Maximum PCB and printing area
  • Stencil frame compatibility
    — Board support requirements
  • Printing accuracy and repeatability
  • Cycle time on the real PCB
  • Software version and interface options
  • Machine age and present condition
  • Included accessories
  • Installation space
  • Service and spare-parts availability
Wooden case smt machine loading bright watermarked

Frequently Asked Questions

Are your equipment compatible with mainstream brand SMT equipment accessories?

All accessories for our equipment are available. For some special models, it is necessary to confirm the interface and parameters in advance, and we can provide technical docking and adaptation solutions.

 

It is recommended to first check the power supply, air source, line connection and emergency stop switch status according to the equipment manual; record the error code and contact technical support, and we will provide remote diagnosis and processing guidance based on the error code.

The standard warranty period for new complete machines is 12 months, and the core components implement corresponding warranty policies according to product models. During the warranty period, free fault maintenance, replacement of parts (excluding man-made damage) and remote technical support are provided. The warranty period for used equipment is 3 months.

Free on-site services are provided for domestic customers, and paid on-site services are provided for overseas customers. After the equipment is delivered, we will arrange professional engineers to complete on-site installation, commissioning and precision calibration, and conduct systematic training on equipment use, daily maintenance and basic fault handling for operators.

Yes. We can provide customized solutions according to the customer’s SMT production line layout, process requirements and production capacity needs, including structural modification, function expansion, software upgrade, etc., with the technical team providing full-process docking and evaluation.

For equipment beyond the warranty period, paid maintenance and service are available. Our company provides long-term stable supply of original and high-quality alternative accessories to ensure that stable accessory support can still be provided within a certain period after the model is discontinued.

Yes. Multiple remote service methods such as telephone, video and remote control are supported. The normal response time on working days is no more than 2 hours, and expedited technical support can be provided in case of emergency.

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