MSO-2006 Turn table Selective Wave Soldering Machine
Suitable for the production of medium-sized consumer electronic products, communication modules and automotive control units. These products require selective soldering of through-hole components on small-sized circuit boards.
MSO-2006 Turn table Selective Wave Soldering Machine Process Flow
Process Flow
Specifications
| Machine Model | MSO-2006 (Customizable) |
| Overall Dimensions | 1350mm(L) × 1420mm(W) × 1865mm(H) |
| PCB Size | Min: 30mm(L) × 30mm(W); Max: 200mm(L) × 200mm(W) |
| Machine Appearance | Closed-type |
| Preheating Method | Bottom infrared preheating |
| Operating Height | 730 ± 20mm (Dimensions customizable per request) |
| Weight | Approx. 600kg |
| Disk Size | Diameter 1000mm |
| Power Supply | 1φ 220V 50/60Hz |
| Total Power | 3kW |
| Temperature Control Mode | PID + SSR |
| Temperature Setting Range | Max 350°C |
| Temperature Accuracy | ±2°C |
| Wave Height | Max 0-8mm |
| Soldering Accuracy | ±0.05mm |
| Motion Axis | X, Y, Z |
| Motion Control | Closed-loop servo control |
| N₂ Consumption | 1.5m³/h (Nitrogen concentration >99.999%) |
Comparison with MSO-1006:
- Larger footprint: 1350×1420×1865mm (vs. 1130×1250×1700mm)
- Larger turntable: φ1000mm (vs. φ950mm)
- Heavier construction: 600kg (vs. 500kg)
- Square PCB capability: Max 200×200mm (vs. 240×140mm rectangular format)
- 6-station rotary configuration for continuous production flow
