PBT-590 Inline vacuum plasma cleaning machine
The PBT-590 online plasma cleaning equipment is mainly targeted at the precision electronic manufacturing industry. Its specific applications include: Mini LED module cleaning, advanced packaging cleaning, BGA substrate cleaning. It can also be used for cleaning of precision components such as camera modules, LED / chip holders, and camera modules.
Product Overview
Applications include:
Mini LED module cleaning: Remove contaminants from the surface of the module to improve product yield and reliability.
Advanced packaging cleaning: Deal with micro contaminants on the surfaces of wafers, COB, IC packages, etc., to ensure packaging quality.
BGA substrate cleaning: Remove welding slag and residual organic substances from the substrate to optimize the welding effect.
It can also be used for cleaning of precision components such as camera modules, LED / chip holders, camera modules, etc.
Brief process flow:
- Loading materials
- Transmission and positioning
- Vacuum chamber sealing
- Plasma cleaning (introducing process gas and exciting plasma to perform surface treatment)
- Chamber depressurization
- Unloading
The entire process is an online automated operation that can seamlessly connect with the production line. It supports the simultaneous input of two gases and realizes data traceability through QR code scanning upload.
PBT-590 Inline vacuum plasma cleaning machine
| Parameter 参数 | Specification 规格 |
|---|---|
| Vacuum System 真空系统 | Oil pump / Dry pump 油泵 / 干泵 |
| Control System 控制系统 | PLC: Delta; HMI: Weinview; Electrical components: Schneider PLC: 台达；触摸屏: 威纶通；电气元件: 施耐德 |
| Aluminum Alloy Sealing Cavity Size 铝合金密封腔体尺寸 | 385×320×115mm (L×W×H) (Customizable) 385×320×115mm（可定制） |
| Effective Cleaning Range 有效清洗范围（产品尺寸） | Max: 270mm×210mm×40mm (L×W×H) 最大: 270mm×210mm×40mm |
| Equipment Overall Size 设备外形尺寸 | 1200×1000×1815mm (L×W×H) 1200×1000×1815mm |
| Cleaning Effect 清洗效果（水接触角） | < 20° 小于 20度 |
| Cleaning Gas Path Number 清洗气路数量 | 2 gas paths 2路气 |
| Cleaning Gas 清洗气体 | AR / N₂ / O₂ / CDA / CF₄ / H₂, etc. 氩气/氮气/氧气/压缩空气/四氟化碳/氢气等 |
| Cleaning Time 清洗时间 | < 60s 小于60秒 |
| Process Gas Flowmeter Range 工艺气体流量计范围 | 0-300 sccm 0-300 sccm |
| Treatment Temperature 处理温度 | < 45℃ 小于45摄氏度 |
| Cleaning Method 清洗方式 | In-line 在线式 |
| MES 制造执行系统 | Reserved 预留接口 |
| Scanning Code 扫码功能 | Reserved 预留 |
| Plasma Generator Power 等离子发生器功率 | 0-600W (adjustable 13.56MHz RF) 0-600W可调（13.56MHz射频） |
| Vacuum Pump Pumping Speed 真空泵抽速 | 40 m³/h (Two-stage rotary vane pump) 40立方米/小时（双级旋片泵） |
